In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation

Y. B. Wang; M. L. Sui; E. Ma

doi:10.1080/09500830701591493

In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation

Y. B. Wang
, M. L. Sui
, E. Ma

CAS - Institute of Metal Research
Johns Hopkins University

Research output: Contribution to journal › Article › peer-review

117 Scopus citations

Abstract

In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundary intersections, and reveals that such migration is the dominant deformation mechanism in the initial stage of plastic straining. The behaviour is discussed in comparison with molecular dynamics simulations and in terms of the unique characteristics of the sample microstructure.

Original language	English
Pages (from-to)	935-942
Number of pages	8
Journal	Philosophical Magazine Letters
Volume	87
Issue number	12
DOIs	https://doi.org/10.1080/09500830701591493
State	Published - Dec 2007
Externally published	Yes

Access to Document

10.1080/09500830701591493

Cite this

@article{a0745406eeb74c0d99868c826b90ccc2,

title = "In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation",

abstract = "In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundary intersections, and reveals that such migration is the dominant deformation mechanism in the initial stage of plastic straining. The behaviour is discussed in comparison with molecular dynamics simulations and in terms of the unique characteristics of the sample microstructure.",

author = "Wang, \{Y. B.\} and Sui, \{M. L.\} and E. Ma",

year = "2007",

month = dec,

doi = "10.1080/09500830701591493",

language = "英语",

volume = "87",

pages = "935--942",

journal = "Philosophical Magazine Letters",

issn = "0950-0839",

publisher = "Taylor and Francis Ltd.",

number = "12",

}

TY - JOUR

T1 - In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation

AU - Wang, Y. B.

AU - Sui, M. L.

AU - Ma, E.

PY - 2007/12

Y1 - 2007/12

N2 - In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundary intersections, and reveals that such migration is the dominant deformation mechanism in the initial stage of plastic straining. The behaviour is discussed in comparison with molecular dynamics simulations and in terms of the unique characteristics of the sample microstructure.

AB - In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundary intersections, and reveals that such migration is the dominant deformation mechanism in the initial stage of plastic straining. The behaviour is discussed in comparison with molecular dynamics simulations and in terms of the unique characteristics of the sample microstructure.

UR - https://www.scopus.com/pages/publications/36248933721

U2 - 10.1080/09500830701591493

DO - 10.1080/09500830701591493

M3 - 文章

AN - SCOPUS:36248933721

SN - 0950-0839

VL - 87

SP - 935

EP - 942

JO - Philosophical Magazine Letters

JF - Philosophical Magazine Letters

IS - 12

ER -

In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation

Abstract

Access to Document

Other files and links

Fingerprint

Cite this