@inproceedings{7073d729b2624268bff26d16da5af177,
title = "Improved performances of all-polyimide fluidic devices using thermal nanoimprinting",
abstract = "Flexible micropumps are important components for advanced microfluidic systems. Here, polyimide (PI) for flexible micropumps was focused on. This is because PI has many advantageous properties such as good biocompatibility, high thermal stability, and superior mechanical strength. However, the difficulty in realizing an all-PI micropump lies in fabricating microstructures on PI film surfaces. In this paper, we present improved performances of a flexible all-PI micropump fabricated using high-temperature hot embossing above 320°C that is considerably higher than its glass transition temperature of 275°C. The fabricated micropump had diffuser/nozzle valves and a chamber with 5 mm diameter, and it was functioned by vibrating a 2-μm-thick PI diaphragm with alternating air pressures outside of the diaphragm. The flow rate of deionized water in the micropump reached to 110 μl/min at 3 Hz.",
keywords = "Fluidic device, Hot embossing, Micropump, Nanoimprinting, Polyimide",
author = "Keigo Kuroda and Takayuki Komori and Hirofumi Saito and Ryuta Ikoma and Yota Kimura and Hiroki Komatsuzaki and Kenta Suzuki and Youn, \{Sung won\} and Hiroshi Hiroshima and Ryutaro Maeda and Yasushiro Nishioka",
year = "2013",
doi = "10.4028/www.scientific.net/AMM.300-301.1360",
language = "英语",
isbn = "9783037856512",
series = "Applied Mechanics and Materials",
pages = "1360--1363",
booktitle = "Mechatronics and Applied Mechanics II",
note = "2nd International Conference on Mechatronics and Applied Mechanics, ICMAM 2012 ; Conference date: 08-12-2012 Through 09-12-2012",
}