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Improved performances of all-polyimide fluidic devices using thermal nanoimprinting

  • Keigo Kuroda
  • , Takayuki Komori
  • , Hirofumi Saito
  • , Ryuta Ikoma
  • , Yota Kimura
  • , Hiroki Komatsuzaki
  • , Kenta Suzuki
  • , Sung won Youn
  • , Hiroshi Hiroshima
  • , Ryutaro Maeda
  • , Yasushiro Nishioka
  • Nihon University
  • National Institute of Advanced Industrial Science and Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Flexible micropumps are important components for advanced microfluidic systems. Here, polyimide (PI) for flexible micropumps was focused on. This is because PI has many advantageous properties such as good biocompatibility, high thermal stability, and superior mechanical strength. However, the difficulty in realizing an all-PI micropump lies in fabricating microstructures on PI film surfaces. In this paper, we present improved performances of a flexible all-PI micropump fabricated using high-temperature hot embossing above 320°C that is considerably higher than its glass transition temperature of 275°C. The fabricated micropump had diffuser/nozzle valves and a chamber with 5 mm diameter, and it was functioned by vibrating a 2-μm-thick PI diaphragm with alternating air pressures outside of the diaphragm. The flow rate of deionized water in the micropump reached to 110 μl/min at 3 Hz.

Original languageEnglish
Title of host publicationMechatronics and Applied Mechanics II
Pages1360-1363
Number of pages4
DOIs
StatePublished - 2013
Externally publishedYes
Event2nd International Conference on Mechatronics and Applied Mechanics, ICMAM 2012 - , Taiwan, Province of China
Duration: 8 Dec 20129 Dec 2012

Publication series

NameApplied Mechanics and Materials
Volume300-301
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2nd International Conference on Mechatronics and Applied Mechanics, ICMAM 2012
Country/TerritoryTaiwan, Province of China
Period8/12/129/12/12

Keywords

  • Fluidic device
  • Hot embossing
  • Micropump
  • Nanoimprinting
  • Polyimide

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