Abstract
When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate - a silicone matrix carrying concentric rigid disks - ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.
| Original language | English |
|---|---|
| Article number | 143511 |
| Journal | Journal of Applied Physics |
| Volume | 115 |
| Issue number | 14 |
| DOIs | |
| State | Published - 14 Apr 2014 |
| Externally published | Yes |