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Holistic thermomechanical model of skin thermal pain

  • University of Cambridge
  • Xi'an Jiaotong University

Research output: Contribution to journalArticlepeer-review

Abstract

Skin thermal pain is one of the most common problems for human in everyday life and in thermal therapies. However, its underlying physical mechanisms are not clearly understood, and there are few attempts to model it. In this paper, a holistic mathematical model for quantifying skin thermal pain sensation is developed. The model is composed of three interconnected parts: peripheral modulation of noxious stimuli, which converts the energy from a noxious thermal stimulus into electrical energy via nerve impulses; transmission, which transports these neural signals from the site of transduction in the skin to the spinal cord and brain; and modulation and perception in the spinal cord and brain. With the holistic model, a direct relationship is built between the level of thermal pain sensation and the character of noxious stimuli.

Original languageEnglish
Pages (from-to)619-628
Number of pages10
JournalLixue Xuebao/Chinese Journal of Theoretical and Applied Mechanics
Volume40
Issue number5
StatePublished - Sep 2008
Externally publishedYes

Keywords

  • Holistic model
  • Skin tissue
  • Thermal pain
  • Thermomechanical model

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