High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

Y. Zhang; Q. S. Zhu; T. Itoh; R. Maeda; A. Toda

doi:10.1109/ICEPT.2013.6756498

High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

Y. Zhang
, Q. S. Zhu
, T. Itoh
, R. Maeda
, A. Toda

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.

Original language	English
Pages	396-399
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2013.6756498
State	Published - 2013
Externally published	Yes
Event	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China Duration: 11 Aug 2013 → 14 Aug 2013

Conference

Conference	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
Country/Territory	China
City	Dalian
Period	11/08/13 → 14/08/13

Keywords

electroless
micro-electro-mechanical systems
nickel
wet etching

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10.1109/ICEPT.2013.6756498

Cite this

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title = "High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging",

abstract = "In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.",

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doi = "10.1109/ICEPT.2013.6756498",

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note = "2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 ; Conference date: 11-08-2013 Through 14-08-2013",

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AU - Zhang, Y.

AU - Zhu, Q. S.

AU - Itoh, T.

AU - Maeda, R.

AU - Toda, A.

PY - 2013

Y1 - 2013

N2 - In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.

AB - In this paper, we present a high-resolution wet etching technology of 1.5 μm-thick electroless nickel alloy film. The minimum feature size was successfully reduced to about 10 μm. The developed etching technology is well compatible to conventional micro-electro-mechanical systems (MEMS) processes, and has been successfully utilized on the 4-inch wafer as well. It could be expected more practical application of electroless nickel alloy film in not only MEMS but also electronic packaging.

KW - electroless

KW - micro-electro-mechanical systems

KW - nickel

KW - wet etching

UR - https://www.scopus.com/pages/publications/84898038224

U2 - 10.1109/ICEPT.2013.6756498

DO - 10.1109/ICEPT.2013.6756498

M3 - 论文

AN - SCOPUS:84898038224

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T2 - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Y2 - 11 August 2013 through 14 August 2013

ER -

High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging

Abstract

Conference

Keywords

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