High-level integration of three-dimensional microcoils array in fused silica

Rapid and facile creation of three-dimensional (3D) microcoils array in a "lab-on-a-chip" platform is a big challenge in micromachining. Here we report a method based on an improved femtosecond-laser wet-etch (FLWE) technology and metal-microsolidifying process for the fabrication of 3D microcoils array inside fused silica. Based on this approach, we fabricated microcoil arrays such as 3 × 3 O-shaped microcoils array and 4 × 4 liner microcoils array. By injecting highmelting-point alloy, the electrocircuit of microcoils array can hardly be disconnected. The microcoils array also exhibits good uniformity and a high integration level. It shows promise as a real application device.