Heterostructure induced dispersive shear bands in heterostructured Cu

  • Y. F. Wang
  • , C. X. Huang
  • , Q. He
  • , F. J. Guo
  • , M. S. Wang
  • , L. Y. Song
  • , Y. T. Zhu

Research output: Contribution to journalArticlepeer-review

98 Scopus citations

Abstract

Here we report the formation of dispersive shear bands in a heterostructured Cu composed of coarse-grained (CG) and ultrafine-grained (UFG) domains. Microscale digital image correlation revealed that dense shear bands evolved in a stable manner over the whole gauge section. Our observation suggests that the limited strain hardening of UFG domains and deformation heterogeneity promoted shear banding, which is a major deformation mechanism in heterostructured materials. The dispersive shear banding helped with ductility retention.

Original languageEnglish
Pages (from-to)76-80
Number of pages5
JournalScripta Materialia
Volume170
DOIs
StatePublished - Sep 2019
Externally publishedYes

Keywords

  • Ductility
  • Heterostructure
  • Heterostructured domain boundary
  • Microscale DIC
  • Shear banding

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