TY - GEN
T1 - Heat-triggered Self-healing Cross-linked Poly(silicone-urea)s with Recoverable Dielectric Performances
AU - Sun, Wenjie
AU - Zhang, Lei
AU - Luo, Jiaming
AU - Mao, Jiale
AU - Xie, Yuanlong
AU - Cheng, Yonghong
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/11
Y1 - 2021/4/11
N2 - Silicone rubbers containing dynamic hindered urea bonds is a potential material for mechanical damages in power equipment. In this work, poly(silicone-urea)s based on isocyanate-piperazine fabricated dynamic hindered urea bonds was synthesized. Insulating performances of materials with different crosslinking density adjusted by the ratio of polydimethylsiloxane and glycerol were also investigated. It was found that higher crosslinking density could improve dielectric properties remarkably. Moreover, the insulating properties can be recovered through healing mechanical scratches due to the dissociative-associative effect of chemical bonds under mild conditions. The permittivity, dielectric loss, and DC volume resistivity of the polymers have not changed significantly after cut-healing. This proves that constructing a reversible chemical bond is a workable method to prepare self-healing insulating materials.
AB - Silicone rubbers containing dynamic hindered urea bonds is a potential material for mechanical damages in power equipment. In this work, poly(silicone-urea)s based on isocyanate-piperazine fabricated dynamic hindered urea bonds was synthesized. Insulating performances of materials with different crosslinking density adjusted by the ratio of polydimethylsiloxane and glycerol were also investigated. It was found that higher crosslinking density could improve dielectric properties remarkably. Moreover, the insulating properties can be recovered through healing mechanical scratches due to the dissociative-associative effect of chemical bonds under mild conditions. The permittivity, dielectric loss, and DC volume resistivity of the polymers have not changed significantly after cut-healing. This proves that constructing a reversible chemical bond is a workable method to prepare self-healing insulating materials.
KW - dielectric performances
KW - dynamic hindered urea bonds
KW - mechanical damages
KW - poly(silicone-urea)s
KW - self-healing
UR - https://www.scopus.com/pages/publications/85114053568
U2 - 10.1109/ICEMPE51623.2021.9509238
DO - 10.1109/ICEMPE51623.2021.9509238
M3 - 会议稿件
AN - SCOPUS:85114053568
T3 - ICEMPE 2021 - 3rd International Conference on Electrical Materials and Power Equipment
BT - ICEMPE 2021 - 3rd International Conference on Electrical Materials and Power Equipment
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Electrical Materials and Power Equipment, ICEMPE 2021
Y2 - 11 April 2021 through 15 April 2021
ER -