Heat transfer in a hybrid integrated power electronic module

The problem of heat transfer from the power circuit to the driver and protection circuit printed circuit board (PCB) in a hybrid integrated power electronic module (IPEM) is investigated. The highest temperatures on the PCB generated from the power circuit heat are calculated via the thermal model of the heat transfer process. The corresponding experimental results coincide well with the calculated ones, which confirm that the thermal resistance between the chip in power circuit and the bottom surface of substrate of the module is 0.45°C/W. Investigation results reveal that the power circuit has great thermal effect on the driver and protection circuit PCB. Under the condition of natural convection, the highest temperature on the PCB is near to 70°C when the chip temperature reaches 85°C, and here the chip heat dissipation rate is 45 W.