Abstract
Ternary Cu3SbSe4 thermoelectric material with a diamond-like structure exhibits good thermoelectric performance in the middle-temperature region. In this study, Cu2.98Co0.02SbSe4 material with intrinsically low thermal conductivity was prepared by a melting–ball milling–hot pressing process. The maximum zT value for the Cu2.98Co0.02SbSe4 sample was 0.7 at 650 K, which was about 190% higher than that of the pristine sample. The improvement in thermoelectric performance was ascribed to the realization of multi-scale features induced by ball milling. It was found that multiple scattering centers of phonons were formed via interfacial engineering, including dislocations, nano-holes and grain boundaries, which offers an applicable pathway for the reduction of lattice thermal conductivity. Graphical Abstract: [Figure not available: see fulltext.]
| Original language | English |
|---|---|
| Pages (from-to) | 4846-4854 |
| Number of pages | 9 |
| Journal | Journal of Electronic Materials |
| Volume | 51 |
| Issue number | 9 |
| DOIs | |
| State | Published - Sep 2022 |
| Externally published | Yes |
Keywords
- Thermoelectric material
- ball milling
- interfacial engineering
- multi-scale scattering centers
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