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Flow boiling heat transfer characteristics of HFO-1234yf for electronic packaging cooling with a microchannel of triangular cross section

  • University of Oslo
  • University of South-Eastern Norway

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The present study focuses on the cooling performance of an environmentally friendly refrigerant HFO-1234yf which serves as a promising working fluid in miniature scale vapor-compression refrigeration system for the thermal management of electronic packaging with high power density. Experimental work was conducted for its flow boiling heat transfer performance in a microchannel with triangular cross section. Flow convection facilitates the effect of boiling in enhancing the heat transfer, particularly in the region with higher the mass flux and lower heat flux. The onset of boiling effect imposed on heat transfer is also being pre-matured by its increasing counterpart from convective flow. The competition between flow convection and boiling takes place leading to either a reduction or a stall in heat transfer performance. A sustenance in high heat transfer coefficient was observed within a certain range of the vapor quality, whereas a speculated 'dry out' effect was also found in presence.

Original languageEnglish
Title of host publication16th International Conference on Electronic Packaging Technology, ICEPT 2015
EditorsHu He, Keyun Bi, Wenhui Zhu
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1422-1426
Number of pages5
ISBN (Electronic)9781467379991
DOIs
StatePublished - 1 Sep 2015
Externally publishedYes
Event16th International Conference on Electronic Packaging Technology, ICEPT 2015 - Changsha, China
Duration: 11 Aug 201514 Aug 2015

Publication series

Name16th International Conference on Electronic Packaging Technology, ICEPT 2015

Conference

Conference16th International Conference on Electronic Packaging Technology, ICEPT 2015
Country/TerritoryChina
CityChangsha
Period11/08/1514/08/15

Keywords

  • Electronic packaging cooling
  • HFO-1234yf
  • flow boiling
  • heat transfer
  • microchannel
  • triangular cross section

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