FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders

Garuma Abdisa Denu; Jibran Hussain Mirani; Jiao Fu; Zongchen Liu; Hongxing Wang

doi:10.1063/1.4978043

FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders

Garuma Abdisa Denu
, Jibran Hussain Mirani
, Jiao Fu
, Zongchen Liu
, Hongxing Wang

Faculty of Electronic and Information Engineering

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.

Original language	English
Article number	035102
Journal	AIP Advances
Volume	7
Issue number	3
DOIs	https://doi.org/10.1063/1.4978043
State	Published - 1 Mar 2017

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10.1063/1.4978043

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@article{a45771daac31479a94fd54ac0933d352,

title = "FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders",

abstract = "The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.",

author = "Denu, \{Garuma Abdisa\} and Mirani, \{Jibran Hussain\} and Jiao Fu and Zongchen Liu and Hongxing Wang",

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doi = "10.1063/1.4978043",

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T1 - FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders

AU - Denu, Garuma Abdisa

AU - Mirani, Jibran Hussain

AU - Fu, Jiao

AU - Liu, Zongchen

AU - Wang, Hongxing

PY - 2017/3/1

Y1 - 2017/3/1

N2 - The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.

AB - The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of carbide interlayer in reduction of interfacial thermal stress is investigated. The results show that the carbide interlayer film thickness is critical in stress reduction for a copper/diamond/copper heat spreader device. Diamond/SiC device has lower interfacial stress without interlayer. The study of mechanical and thermal property of diamond heat spreader is useful for optimal designs of efficient heat spreader for electronic components.

UR - https://www.scopus.com/pages/publications/85014473003

U2 - 10.1063/1.4978043

DO - 10.1063/1.4978043

M3 - 文章

AN - SCOPUS:85014473003

SN - 2158-3226

VL - 7

JO - AIP Advances

JF - AIP Advances

IS - 3

M1 - 035102

ER -

FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders

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