Fabrication of Ni-Al2O3 composite microcomponent by electroforming

X. Y. Wei; Z. G. Zhu; P. D. Prewett; K. Jiang

doi:10.1016/j.mee.2007.01.218

Fabrication of Ni-Al₂O₃ composite microcomponent by electroforming

X. Y. Wei
, Z. G. Zhu
, P. D. Prewett
, K. Jiang

University of Birmingham

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

Thick nickel-alumina (Ni-Al₂O₃) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications.

Original language	English
Pages (from-to)	1256-1259
Number of pages	4
Journal	Microelectronic Engineering
Volume	84
Issue number	5-8
DOIs	https://doi.org/10.1016/j.mee.2007.01.218
State	Published - May 2007
Externally published	Yes

Keywords

Alumina nanoparticles
Electroforming
Microcomponent

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10.1016/j.mee.2007.01.218

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title = "Fabrication of Ni-Al2O3 composite microcomponent by electroforming",

abstract = "Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications.",

keywords = "Alumina nanoparticles, Electroforming, Microcomponent",

author = "Wei, \{X. Y.\} and Zhu, \{Z. G.\} and Prewett, \{P. D.\} and K. Jiang",

year = "2007",

month = may,

doi = "10.1016/j.mee.2007.01.218",

language = "英语",

volume = "84",

pages = "1256--1259",

journal = "Microelectronic Engineering",

issn = "0167-9317",

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TY - JOUR

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AU - Wei, X. Y.

AU - Zhu, Z. G.

AU - Prewett, P. D.

AU - Jiang, K.

PY - 2007/5

Y1 - 2007/5

N2 - Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications.

AB - Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications.

KW - Alumina nanoparticles

KW - Electroforming

KW - Microcomponent

UR - https://www.scopus.com/pages/publications/34247603505

U2 - 10.1016/j.mee.2007.01.218

DO - 10.1016/j.mee.2007.01.218

M3 - 文章

AN - SCOPUS:34247603505

SN - 0167-9317

VL - 84

SP - 1256

EP - 1259

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 5-8

ER -

Fabrication of Ni-Al₂O₃ composite microcomponent by electroforming

Abstract

Keywords

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