TY - GEN
T1 - Fabrication and Assembly of All-quartz Integrated Resonant Accelerometer with High Stability
AU - Xue, Hong
AU - Zhou, Shengxiang
AU - Bu, Kai
AU - Zhang, Zichao
AU - Zhao, Yulong
AU - Li, Cun
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Drift degrades stability of MEMS accelerometer a lot, in terms of temperature and long-term impacts. This study proposed an integrated resonant accelerometer with an all-quartz sensitive structure, which was designed to achieve resistance to temperature and long-term drift. Processes such as wet etching, quartz-on-quartz direct bonding, and femtosecond laser micro welding were utilized to fabricate and assemble the prototype. Experimental platforms were built up to characterize its stability, and results demonstrated that the stability at full-temperature range was 34.64 μg/oC, and the long-term stability was less than 100 μg. Combined with stability performances already measured, the accelerometer is comparable to, or even better than, state-of-the-art counterparts without compensation.
AB - Drift degrades stability of MEMS accelerometer a lot, in terms of temperature and long-term impacts. This study proposed an integrated resonant accelerometer with an all-quartz sensitive structure, which was designed to achieve resistance to temperature and long-term drift. Processes such as wet etching, quartz-on-quartz direct bonding, and femtosecond laser micro welding were utilized to fabricate and assemble the prototype. Experimental platforms were built up to characterize its stability, and results demonstrated that the stability at full-temperature range was 34.64 μg/oC, and the long-term stability was less than 100 μg. Combined with stability performances already measured, the accelerometer is comparable to, or even better than, state-of-the-art counterparts without compensation.
KW - direct bonding
KW - femtosecond laser
KW - resonant accelerometer
KW - stability
KW - wet etching
UR - https://www.scopus.com/pages/publications/85215292255
U2 - 10.1109/SENSORS60989.2024.10785081
DO - 10.1109/SENSORS60989.2024.10785081
M3 - 会议稿件
AN - SCOPUS:85215292255
T3 - Proceedings of IEEE Sensors
BT - 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE Sensors, SENSORS 2024
Y2 - 20 October 2024 through 23 October 2024
ER -