Abstract
Thermal management at a high heat flux is crucial for high-power electronic devices, and jet impingement cooling is a promising solution. In this paper, a hybrid heat sink combining a microchannel and jet impingement was designed, fabricated and tested in a closed-loop system with R134a as the working fluid. The thermal contact resistance was measured by using the steady-state method, and the thermal resistance of the heat sink was obtained at different heat fluxes and flow rates. The maximum heat dissipation of 400 W/cm2 is achieved on a heater area of 210 mm2, and the thermal resistance of the heat sink is 0.11 K/W with a pressure drop of 13.5 kPa under a flow rate of 1.90 L/min. Low thermal resistance can be achieved for the hybrid heat sink stemming from the highly-dense micro-jet array with separate inflow and outflow microchannels.
| Original language | English |
|---|---|
| Article number | 13033 |
| Journal | Applied Sciences (Switzerland) |
| Volume | 12 |
| Issue number | 24 |
| DOIs | |
| State | Published - Dec 2022 |
Keywords
- electronics cooling
- heat management
- jet impingement
- microchannel heat sink
- thermal resistance
Fingerprint
Dive into the research topics of 'Experimental Study on Cooling Performance of a Hybrid Microchannel and Jet Impingement Heat Sink'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver