TY - JOUR
T1 - Experimental and density functional studies on the corrosion behavior of the copper-nickel-tin alloy
AU - Yin, Bing
AU - Yin, Yansheng
AU - Lei, Yanhua
AU - Dong, Lihua
AU - Zhang, Yijun
PY - 2011/6/14
Y1 - 2011/6/14
N2 - The corrosion behavior of copper-nickel-tin alloy in seawater with and without SRB has been tested by electrochemical techniques, SEM micrographs and EDX spectra. The geometric and electronic structure and active sites of Cu n, Cun-1Ni and Cun-1Sn (n ≤ 9) clusters have been studied using DFT. The results indicated nickel and tin preferred to be the surface or outer layer in copper alloy, formed an oxide film on surface, then alloy would be corroded to Cu2O mostly after immersion. The corrosion process was accelerated in the presence of SRB, the mainly corrosion product was Cu2S, which was less protective for alloy.
AB - The corrosion behavior of copper-nickel-tin alloy in seawater with and without SRB has been tested by electrochemical techniques, SEM micrographs and EDX spectra. The geometric and electronic structure and active sites of Cu n, Cun-1Ni and Cun-1Sn (n ≤ 9) clusters have been studied using DFT. The results indicated nickel and tin preferred to be the surface or outer layer in copper alloy, formed an oxide film on surface, then alloy would be corroded to Cu2O mostly after immersion. The corrosion process was accelerated in the presence of SRB, the mainly corrosion product was Cu2S, which was less protective for alloy.
UR - https://www.scopus.com/pages/publications/79957855265
U2 - 10.1016/j.cplett.2011.04.100
DO - 10.1016/j.cplett.2011.04.100
M3 - 文章
AN - SCOPUS:79957855265
SN - 0009-2614
VL - 509
SP - 192
EP - 197
JO - Chemical Physics Letters
JF - Chemical Physics Letters
IS - 4-6
ER -