TY - GEN
T1 - Evaluation of LTCC capacitors and inductors in DC/DC converters
AU - Wang, Laili
AU - Pei, Yunqing
AU - Yang, Xu
AU - Song, Bo
AU - Wang, Zhaoan
AU - Zhao, Guopeng
PY - 2010
Y1 - 2010
N2 - Low temperature co-fired ceramic (LTCC) technology has been proved to be an effective way to realize system integration. By using this technology, passive components in a DC/DC converter could be integrated into a passive substrate. This paper presents fabrication and evaluation of LTCC capacitors and inductors and summarizes challenges of applying LTCC technology to DC/DC converters. Four capacitors are made; two of them are made with single layer high permittivity thick film paste, and maximum 1.1μF capacitance is obtained; the other two are made with multilayer low permittivity LTCC tapes, maximum 30nF capacitance is obtained. A 70nH LTCC inductor is also fabricated with ferrite tapes. It is tested in a 1.2MHz buck converter and a 30MHz class Φ2 DC/DC converter. Finally, challenges of conductor resistance, capacitor tape permittivity, and shrinkage matching are discussed and summarized.
AB - Low temperature co-fired ceramic (LTCC) technology has been proved to be an effective way to realize system integration. By using this technology, passive components in a DC/DC converter could be integrated into a passive substrate. This paper presents fabrication and evaluation of LTCC capacitors and inductors and summarizes challenges of applying LTCC technology to DC/DC converters. Four capacitors are made; two of them are made with single layer high permittivity thick film paste, and maximum 1.1μF capacitance is obtained; the other two are made with multilayer low permittivity LTCC tapes, maximum 30nF capacitance is obtained. A 70nH LTCC inductor is also fabricated with ferrite tapes. It is tested in a 1.2MHz buck converter and a 30MHz class Φ2 DC/DC converter. Finally, challenges of conductor resistance, capacitor tape permittivity, and shrinkage matching are discussed and summarized.
UR - https://www.scopus.com/pages/publications/77952206859
U2 - 10.1109/APEC.2010.5433519
DO - 10.1109/APEC.2010.5433519
M3 - 会议稿件
AN - SCOPUS:77952206859
SN - 9781424447824
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 2060
EP - 2065
BT - APEC 2010 - 25th Annual IEEE Applied Power Electronics Conference and Exposition
T2 - 25th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2010
Y2 - 21 February 2010 through 25 February 2010
ER -