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Evaluation mechanical properties of MEMS material's

  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The principles of transforming the original measured data into the real load and displacement of indenter, and determining the related parameters of the load-displacement curve using the least square curve fitting are described. Three methods of computing the real contact projection area are proposed according to the nominal sizes of indenter, the measured sizes of indenter and a lot of indentations on standard blocks or samples. Besides, the program also has a database of mechanical properties of more than 100 MEMS materials for references and some statistic analysis functions for the further analysis. An evaluation result of elastic modulus of Si (100) using indentation is given.

Original languageEnglish
Title of host publicationProceedings of the Second International Symposium on Instrumentation Science and Technology
EditorsT. Jiubin, W. Xianfang, T. Jiubin, W. Xianfang
Pages2/139-2/144
StatePublished - 2002
EventProceedings of the second International Symposium on Instrumentation Science and Technology - Jinan, China
Duration: 18 Aug 2002 → 22 Aug 2002

Publication series

NameProceedings of the Second International Symposium on Instrumentation Science and Technology
Volume2

Conference

ConferenceProceedings of the second International Symposium on Instrumentation Science and Technology
Country/TerritoryChina
CityJinan
Period18/08/02 → 22/08/02

Keywords

  • Beam bending
  • Data pre-processing
  • Elastic modulus
  • Fracture toughness
  • Hardness
  • MEMS materials
  • Mechanical properties
  • Nanoindentation

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