TY - GEN
T1 - Estimation Method of Interfacial Stress Distribution by Inverse Analysis of Deformed Shape Data
AU - Kishimoto, Yoshinao
AU - Kobayashi, Yukiyoshi
AU - Jin, Feng
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - A novel estimation method of interfacial stress distribution at bonded parts has been developed by inverse analysis techniques. From the deformed shape of the target adherend measured by laser sensors, the stress distribution between the adherend and the adhesive is computed by the finite element analysis and the Tikhonov regularization. This estimation method requires only the constituent equation and the material constants of the target adherend which is modeled easier than the whole structure including the adhesive. A peel test has been conducted to investigate the behavior of the proposed method. The test results show that the regularization parameter takes optimal value when the sum of the estimated stress distribution is at its maximum value, and the magnitude of the estimated stress agrees with that in the results of the uniaxial tensile test.
AB - A novel estimation method of interfacial stress distribution at bonded parts has been developed by inverse analysis techniques. From the deformed shape of the target adherend measured by laser sensors, the stress distribution between the adherend and the adhesive is computed by the finite element analysis and the Tikhonov regularization. This estimation method requires only the constituent equation and the material constants of the target adherend which is modeled easier than the whole structure including the adhesive. A peel test has been conducted to investigate the behavior of the proposed method. The test results show that the regularization parameter takes optimal value when the sum of the estimated stress distribution is at its maximum value, and the magnitude of the estimated stress agrees with that in the results of the uniaxial tensile test.
KW - adhesion
KW - finite element analysis
KW - interfacial stress
KW - inverse problem
KW - multi-material structure
UR - https://www.scopus.com/pages/publications/85123601406
U2 - 10.1109/SENSORS47087.2021.9639651
DO - 10.1109/SENSORS47087.2021.9639651
M3 - 会议稿件
AN - SCOPUS:85123601406
T3 - Proceedings of IEEE Sensors
BT - 2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Sensors, SENSORS 2021
Y2 - 31 October 2021 through 4 November 2021
ER -