Enhancement in Electrical Properties of UV-cured Resin by Establishing H-bonding between Al2O3 Nanoparticles and Acrylate Molecular Chain

  • Xiong Yang
  • , Wendong Li
  • , Chao Wang
  • , Zhihui Jiang
  • , Minyu Chen
  • , Guanjun Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Surface functionalization of AlOnanoparticles by HOand 1H, 1H, 2H, 2H-perfluorooctyltriethoxysilane was developed to improve the dielectric properties of UV-cured resin matrix (UV). Herein, interfacial hydrogen bonds were established between AlOnanofillers and acrylate molecular chain by using surface hydroxylated AlO (h-AlO) and fluorine modified AlO (f-AlO) nanoparticles. And then, the UV based composites filled with c-AlO, h-AlOand f-AlOparticles were fabricated. The electrical properties of composites and the effect of interfacial strength on electrical properties were systematically investigated. It is found that the electrical properties are closely related to interfacial bonding strength and trap levels. The greater interfacial strength leads to larger the volume of the interaction zone, and larger electrostatic potential leads to deeper trap levels with enhanced trapping effect, thereby restraining the carriers injection and migration. As a result, UV/h-AlOand UV/f-AlOcomposites exhibit better space charge suppression characteristics, larger volume resistivity, and higher breakdown strength than that of UV/c-AlOcomposites. The research results are conducive to promoting SLA 3D printing in application of electrical and electronic field.

Original languageEnglish
Title of host publication7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728155111
DOIs
StatePublished - 6 Sep 2020
Event7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Beijing, China
Duration: 6 Sep 202010 Sep 2020

Publication series

Name7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Proceedings

Conference

Conference7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020
Country/TerritoryChina
CityBeijing
Period6/09/2010/09/20

Keywords

  • hydrogen bond
  • interfacial region
  • nanocomposites
  • stereolithography
  • trap levels

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