Enhanced high thermal conductivity and low permittivity of polyimide based composites by core-shell Ag@SiO 2 nanoparticle fillers

  • Yongcun Zhou
  • , Lu Wang
  • , Hu Zhang
  • , Yuanyuan Bai
  • , Yujuan Niu
  • , Hong Wang

Research output: Contribution to journalArticlepeer-review

91 Scopus citations

Abstract

A kind of polymer based composites was prepared by embedding the fillers of core-shell Ag@SiO 2 nanoparticles into the polyimide (PI) matrix. The obtained Ag@SiO 2/PI (50% vf of fillers) composites show remarkably improved high thermal conductivity and low relative permittivity. The maximum value of the thermal conductivity of composites is 7.88 W/(mK) and the relative permittivity and dielectric loss are about 11.7 and 0.015 at 1 MHz, respectively. Compared with self-passivated nanometer Al particles composites, core-shell Ag@SiO 2 nano-composite is beneficial to increase the thermal conductivity and reduce the permittivity of the composites. The relative mechanism was studied and discussed.

Original languageEnglish
Article number012903
JournalApplied Physics Letters
Volume101
Issue number1
DOIs
StatePublished - 2 Jul 2012

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