Enhanced flow boiling heat transfer of FC-72 on micro-pin-finned silicon surfaces

For efficiently cooling electronic components, the flow boiling heat transfer performance of FC-72 on micro-pin-finned silicon chips were studied. Two kinds of micro-pin-fins were used, which have the same fin thickness of 30μm but different fin heights of 60 and 120μm, respectively. The boiling heat transfer performance was much better for the micro-pin-fined surfaces than that for a smooth surface, and increased with increasing fin height. The critical heat flux increased with fluid velocity and subcooling, and the wall temperatures at the critical heat flux for micro-pin-finned chips were less than the upper temperature limit for the normal operation of electronic components, 85°C.