EMI Analysis of Full-SiC Integrated Power Module

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

Abstract

Due to the high dv/dt and di/dt slew rates, the electromagnetic interference (EMI) issue in the high power level power module is serious. In this paper, a novel EMI model of full-SiC power module is proposed based on the ANSYS Q3D software and the EMI mechanical is analyzed by discussing the EMI coupling paths both in common-mode (CM) interference and differential-mode (DM) interference. Then, a synchronous buck converter based on the full-SiC power module is simulated in the ANSYS Simplorer software. Finally, a synchronous buck experimental platform based on a 1200V, 288A full-SiC power module is tested. It is found that the intensity of EMI increases as the voltage and current of power module increase. The intensity of the CM EMI presents uniform distribution along with frequency and a resonant peak appears at specific frequency points of the DM EMI.

Original languageEnglish
Title of host publication2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3329-3331
Number of pages3
ISBN (Electronic)9784886864055
DOIs
StatePublished - 22 Oct 2018
Event8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
Duration: 20 May 201824 May 2018

Publication series

Name2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018

Conference

Conference8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Country/TerritoryJapan
CityNiigata
Period20/05/1824/05/18

Keywords

  • EMI
  • full-SiC
  • power module

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