Embedded manifold microchannel cooling for chiplet thermal management

The chiplet architecture enhances chip performance, but it also leads to heat accumulation, necessitating efficient cooling techniques. Recent studies have demonstrated embedded manifold microchannel cooling (EMMC) as a promising thermal management technique. However, there is still a lack of comprehensive investigation on embedded cooling for chiplet architechture. This study introduces the idea of EMMC into the chiplet architecture and proposes the embedded chiplet cooling (ECC), where microchannels are directly etched onto chips and integrated with 3D-printed manifolds. The proposed method ensures all chips to operate under designated heat loads. Under the highest tested heat flux of 81W/cm² and flow rate of 0.8LPM, the average temperature rise is mitigated to 66.0°C. Results also demonstrate that total thermal resistances decrease with increased flow rates, achieving a total thermal resistance of 0.30K/W at a flow rate of 0.8LPM. Moreover, higher flow rates improve temperature uniformity; when the flow rate increased from 0.4LPM to 0.8LPM under a heat flux of 46.7W/cm², the standard deviation of chips' temperatures decreased from 8.85°C to 3.09°C Additionally, the proposed cooling technique compensates for height disparity and warpage within chip, ensuring reliability and enabling embedded cooling in more complex scenarios.