@inproceedings{1c4e80b807834a5287a97a27996ead69,
title = "Electrochemical Migration Investigations on SAC-Bi-xMn Solder Alloys",
abstract = "Water drop (WD) test was applied to get more information about the electrochemical migration (ECM) behaviour on various SAC-Bi-xMn alloys using NaCI and Na2S04 solutions. ECM is sort of electrical short failure process, which can resulted in series failure in case of loaded circuits, when humidity appears on/in a conductor-dielectric-conductor structure. The results show that the higher Mn content solder alloys showed relative low Mean Time To Failure (MTTF) values, while in the case of Bi content solder alloys relative higher MTTF values were calculated.",
keywords = "Na2S04, NaCI, SAC solder, electrochemical migration, water drop test",
author = "B{\'a}lint Medgyes and Emil Rom{\'a}n and {\'A}d{\'a}m Bohnert and Szabolcs Szurd{\'a}n and Xiankang Zhong and G{\'a}bor Hars{\'a}nyi",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, SIITME 2018 ; Conference date: 25-10-2018 Through 28-10-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/SIITME.2018.8599238",
language = "英语",
series = "2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, SIITME 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "80--83",
booktitle = "2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging, SIITME 2018 - Proceedings",
}