TY - JOUR
T1 - Electret-Inspired Charge-Injected Hydrogel for Scar-Free Healing of Bacterially Infected Burns Through Bioelectrical Stimulation and Immune Modulation
AU - Liu, Mujie
AU - Wang, Yuheng
AU - Wang, Haodong
AU - Qi, Lihong
AU - Shang, Yuxuan
AU - Song, Jiajie
AU - Feng, Xiulong
AU - Chen, Yiwei
AU - Memon, Waqar Ali
AU - Shen, Yuping
AU - Wu, Xiaodong
AU - Cao, Jiangbei
AU - Zhao, Yifan
AU - Jiang, Zhuangde
AU - Liu, Dingxin
AU - Shafique, Shareen
AU - Li, Shengtao
AU - Lu, Guanghao
AU - Wei, Zhixiang
AU - Liu, Zhijie
AU - Zhou, Kun
AU - Quan, Yuping
AU - Zhang, Xiaoyu
AU - Zou, Xin
AU - Wang, Xuefeng
AU - Liu, Na
AU - Zhang, Yaqing
AU - Hu, Yiwei
AU - Han, Chao
AU - Wang, Wen
N1 - Publisher Copyright:
© 2025 The Author(s). Advanced Science published by Wiley-VCH GmbH.
PY - 2025/4/3
Y1 - 2025/4/3
N2 - In this study, an electret-inspired, charge-injected hydrogel called QOSP hydrogel (QCS/OD/SDI/PANI/PS/Plasma) that promotes scar-free healing of bacteria-infected burns through bioelectrical stimulation and immune modulation, is presented. The hydrogel, composed of quaternized chitosan (QCS), oxidized dextran (OD), sulfadiazine (SDI), polystyrene (PS), and polyaniline nanowires (PANI), forms a conductive network capable of storing and releasing electric charges, emulating an electret-like mechanism. This structure delivers bioelectrical signals continuously, enhancing wound healing by regulating immune responses and minimizing fibrosis. In a mouse model of second-degree burns infected with Staphylococcus aureus (SA) and Pseudomonas aeruginosa (PA), the hydrogel accelerates wound healing by 32% and reduces bacterial load by 60%, significantly inhibited scar formation by 40% compared to controls. QOSP hydrogel modulates the Th1/Th2 immune balance toward a Th1-dominant antifibrotic state through quaternized chitosan, thereby reducing collagen deposition by 35%. Electro-dielectric characterization reveals a dielectric constant of 6.2, a 34% improvement in conductivity (3.33 × 10−5 S/m) and a 30 °C increase in thermal stability. Proteomic analysis highlights a 50% down-regulation of pro-inflammatory and pro-fibrotic pathways, suggesting a controlled immune response conducive to scar-free healing. This study underscores the potential of bioelectrically active hydrogels as a novel approach for treating infected wounds prone to scarring.
AB - In this study, an electret-inspired, charge-injected hydrogel called QOSP hydrogel (QCS/OD/SDI/PANI/PS/Plasma) that promotes scar-free healing of bacteria-infected burns through bioelectrical stimulation and immune modulation, is presented. The hydrogel, composed of quaternized chitosan (QCS), oxidized dextran (OD), sulfadiazine (SDI), polystyrene (PS), and polyaniline nanowires (PANI), forms a conductive network capable of storing and releasing electric charges, emulating an electret-like mechanism. This structure delivers bioelectrical signals continuously, enhancing wound healing by regulating immune responses and minimizing fibrosis. In a mouse model of second-degree burns infected with Staphylococcus aureus (SA) and Pseudomonas aeruginosa (PA), the hydrogel accelerates wound healing by 32% and reduces bacterial load by 60%, significantly inhibited scar formation by 40% compared to controls. QOSP hydrogel modulates the Th1/Th2 immune balance toward a Th1-dominant antifibrotic state through quaternized chitosan, thereby reducing collagen deposition by 35%. Electro-dielectric characterization reveals a dielectric constant of 6.2, a 34% improvement in conductivity (3.33 × 10−5 S/m) and a 30 °C increase in thermal stability. Proteomic analysis highlights a 50% down-regulation of pro-inflammatory and pro-fibrotic pathways, suggesting a controlled immune response conducive to scar-free healing. This study underscores the potential of bioelectrically active hydrogels as a novel approach for treating infected wounds prone to scarring.
KW - bacterially infected burns
KW - bioelectrical stimulation
KW - charge-injected hydrogel
KW - electrets
KW - fibrosis inhibition
KW - immune modulation
KW - scar-free healing
UR - https://www.scopus.com/pages/publications/105001715685
U2 - 10.1002/advs.202411889
DO - 10.1002/advs.202411889
M3 - 文章
C2 - 39951351
AN - SCOPUS:105001715685
SN - 2198-3844
VL - 12
JO - Advanced Science
JF - Advanced Science
IS - 13
M1 - 2411889
ER -