Abstract
Numerical simulation technique is used to investigate the effects of a compound angle (30°, 45° or 60°) on the film cooling performance based on a trench-shaped hole geometry. From the film cooling efficiency and velocity distribution, the results indicate that the compound angle can improve the lateral coverage of cooling film over a hot surface. Moreover, with the increase of the compound angle, the cooling film shows considerable uniform cover and better cooling performance, especially at a high blowing ratio.
| Original language | English |
|---|---|
| Pages (from-to) | 1723-1725 |
| Number of pages | 3 |
| Journal | Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics |
| Volume | 30 |
| Issue number | 10 |
| State | Published - Oct 2009 |
Keywords
- Compound angle
- Film cooling
- Trench-shaped hole