Skip to main navigation Skip to search Skip to main content

Effect of weight ratio of thermoplastic and thermosetting boron-containing phenolic resin on mechanical, bonding, and ablative properties of thermal insulating composites

  • Xi'an Jiaotong University

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

To improve the tensile strength, the bond strength, and the ablation resistant properties as well as the elongation at break of the short aramid fibers reinforced EPDM-based thermal insulation composites, two kinds of boron-containing phenolic resin, thermoplastic (TPBPR) and thermosetting (TSBPR), were added into the composites with a series of weight ratio of TPBPR and TSBPR, such as 0:20, 5:15, 10:10, 15:5, and 20:0. The effects of TPBPR and TSBPR weight ratio on the mechanical, bonding, and ablative properties of the composites were investigated systematically, respectively. The results showed that the crosslink density, the tensile strength, the bond strength, and the ablation resistant abilities of the composites decrease continuously with the increasing weight ratio, which confirms that the mechanical reinforcement and the ablation resistant abilities of TSBPR are higher than that of TPBPR. However, the elongation increases sharply with TPBPR and TSBPR weight ratio increasing. Therefore, the optimal weight ratio of TPBPR and TSBPR should be 10:10 to obtain the very thermal insulation composites with the excellent comprehensive properties.

Original languageEnglish
Pages (from-to)266-274
Number of pages9
JournalJournal of Applied Polymer Science
Volume118
Issue number1
DOIs
StatePublished - 5 Oct 2010

Keywords

  • Composites
  • High performance polymers
  • Resins
  • Thermal properties

Fingerprint

Dive into the research topics of 'Effect of weight ratio of thermoplastic and thermosetting boron-containing phenolic resin on mechanical, bonding, and ablative properties of thermal insulating composites'. Together they form a unique fingerprint.

Cite this