Effect of Flow Rate and Precursor Sublimation Temperature on the LPCVD Growth of Hexagonal Boron Nitride

  • Dujiao Zhang
  • , Guodong Meng
  • , Kejing Wang
  • , Xinyu Gao
  • , Chengye Dong
  • , Feihong Wu
  • , Yonghong Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Hexagonal boron nitride (h-BN) is known as promising 2D material with a wide band-gap ( 5.2 sim 5.9 eV) which has high breakdown strength. To synthesize h-BN films, chemical vapor deposition (CVD) method is proved to be an effective method that allows the scaled synthesis of h-BN. In this study, we demonstrate a low pressure chemical vapor deposition (LPCVD) method to synthesize complete and uniform h-BN films. In order to obtain high crystalline h-BN films, we studied the flow rate of carrier gas and precursor sublimation temperature on the growth of h-BN films. The results indicate the flow rate of carrier gas has little influence on growth of h-BN films. Nevertheless, the lower precursor sublimation temperature contributes to lower growth rate, which makes the thickness of h-BN films is easily controlled. When the sublimation temperature is more than 100 the thickness of h-BN films is hard to control. The breakdown strength of h-BN films is higher than 9.0 MV/cm from the I-V test, which makes h-BN films ideal substrates and insulators for 2D microelectronic devices.

Original languageEnglish
Title of host publication2018 IEEE 2nd International Conference on Dielectrics, ICD 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538663899
DOIs
StatePublished - 19 Sep 2018
Event2nd IEEE International Conference on Dielectrics, ICD 2018 - Budapest, Hungary
Duration: 1 Jul 20185 Jul 2018

Publication series

Name2018 IEEE 2nd International Conference on Dielectrics, ICD 2018

Conference

Conference2nd IEEE International Conference on Dielectrics, ICD 2018
Country/TerritoryHungary
CityBudapest
Period1/07/185/07/18

Keywords

  • 2D material
  • Breakdown strength
  • CVD
  • Electrochemical polished
  • H-BN
  • Synthesis

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