Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance

Xin Zhang; Yongmei Gan; Tongyu Zhang; Xiaodong Hou; Guolian Guan; Wenbo Fan; Laili Wang; Kai Gao

doi:10.30420/566414019

Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance

Xin Zhang
, Yongmei Gan
, Tongyu Zhang
, Xiaodong Hou
, Guolian Guan
, Wenbo Fan
, Laili Wang
, Kai Gao

School of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Cu clip-bonding has lower resistance and lower inductance than wire-bonding, but unbalanced dynamic current still exists between paralleled silicon carbide (SiC) MOSFETs, limiting the available current capacity of Cu clip-bonded SiC power modules. This paper presents a parasitic inductance equivalent circuit model at switching transients, and a dynamic current balancing optimization guideline based on self- and mutual inductance of main current path segments is determined. The mismatch of the equivalent power source parasitic inductances is reduced by adjusting the bonding positions and shape parameters of Cu clips. Simulation results show that the dynamic current sharing performance is greatly improved.

Original language	English
Title of host publication	PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Publisher	VDE Verlag GmbH
Pages	106-110
Number of pages	5
ISBN (Electronic)	9783800764150
DOIs	https://doi.org/10.30420/566414019
State	Published - 2024
Event	2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2024 - Shenzhen, China Duration: 28 Aug 2024 → 30 Aug 2024

Publication series

Name	PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Volume	2024-August
ISSN (Print)	2510-7704

Conference

Conference	2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2024
Country/Territory	China
City	Shenzhen
Period	28/08/24 → 30/08/24

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Access to Document

10.30420/566414019

Cite this

Zhang, X., Gan, Y., Zhang, T., Hou, X., Guan, G., Fan, W., Wang, L., & Gao, K. (2024). Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance. In PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 106-110). (PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Vol. 2024-August). VDE Verlag GmbH. https://doi.org/10.30420/566414019

Zhang, Xin ; Gan, Yongmei ; Zhang, Tongyu et al. / Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance. PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH, 2024. pp. 106-110 (PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).

@inproceedings{e2e1bff7c72945da8b1b12ea316fa93f,

title = "Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance",

abstract = "Cu clip-bonding has lower resistance and lower inductance than wire-bonding, but unbalanced dynamic current still exists between paralleled silicon carbide (SiC) MOSFETs, limiting the available current capacity of Cu clip-bonded SiC power modules. This paper presents a parasitic inductance equivalent circuit model at switching transients, and a dynamic current balancing optimization guideline based on self- and mutual inductance of main current path segments is determined. The mismatch of the equivalent power source parasitic inductances is reduced by adjusting the bonding positions and shape parameters of Cu clips. Simulation results show that the dynamic current sharing performance is greatly improved.",

author = "Xin Zhang and Yongmei Gan and Tongyu Zhang and Xiaodong Hou and Guolian Guan and Wenbo Fan and Laili Wang and Kai Gao",

note = "Publisher Copyright: {\textcopyright} VDE VERLAG GMBH.; 2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2024 ; Conference date: 28-08-2024 Through 30-08-2024",

year = "2024",

doi = "10.30420/566414019",

language = "英语",

series = "PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management",

publisher = "VDE Verlag GmbH",

pages = "106--110",

booktitle = "PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management",

}

Zhang, X, Gan, Y, Zhang, T, Hou, X, Guan, G, Fan, W, Wang, L & Gao, K 2024, Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance. in PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, vol. 2024-August, VDE Verlag GmbH, pp. 106-110, 2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2024, Shenzhen, China, 28/08/24. https://doi.org/10.30420/566414019

Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance. / Zhang, Xin; Gan, Yongmei; Zhang, Tongyu et al.
PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH, 2024. p. 106-110 (PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Vol. 2024-August).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance

AU - Zhang, Xin

AU - Gan, Yongmei

AU - Zhang, Tongyu

AU - Hou, Xiaodong

AU - Guan, Guolian

AU - Fan, Wenbo

AU - Wang, Laili

AU - Gao, Kai

PY - 2024

Y1 - 2024

N2 - Cu clip-bonding has lower resistance and lower inductance than wire-bonding, but unbalanced dynamic current still exists between paralleled silicon carbide (SiC) MOSFETs, limiting the available current capacity of Cu clip-bonded SiC power modules. This paper presents a parasitic inductance equivalent circuit model at switching transients, and a dynamic current balancing optimization guideline based on self- and mutual inductance of main current path segments is determined. The mismatch of the equivalent power source parasitic inductances is reduced by adjusting the bonding positions and shape parameters of Cu clips. Simulation results show that the dynamic current sharing performance is greatly improved.

AB - Cu clip-bonding has lower resistance and lower inductance than wire-bonding, but unbalanced dynamic current still exists between paralleled silicon carbide (SiC) MOSFETs, limiting the available current capacity of Cu clip-bonded SiC power modules. This paper presents a parasitic inductance equivalent circuit model at switching transients, and a dynamic current balancing optimization guideline based on self- and mutual inductance of main current path segments is determined. The mismatch of the equivalent power source parasitic inductances is reduced by adjusting the bonding positions and shape parameters of Cu clips. Simulation results show that the dynamic current sharing performance is greatly improved.

UR - https://www.scopus.com/pages/publications/85216113556

U2 - 10.30420/566414019

DO - 10.30420/566414019

M3 - 会议稿件

AN - SCOPUS:85216113556

T3 - PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

SP - 106

EP - 110

BT - PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

PB - VDE Verlag GmbH

T2 - 2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2024

Y2 - 28 August 2024 through 30 August 2024

ER -

Zhang X, Gan Y, Zhang T, Hou X, Guan G, Fan W et al. Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance. In PCIM Asia 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH. 2024. p. 106-110. (PCIM Asia-International Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management). doi: 10.30420/566414019

Dynamic Current Balancing Optimization of Cu Clip-Bonded SiC power module Based on Layout-Dominated Parasitic Inductance

Abstract

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UN SDGs

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