Skip to main navigation Skip to search Skip to main content

DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module

Research output: Contribution to journalArticlepeer-review

Abstract

In this brief, a novel differential-mode (DM) interference propagation mathematical modeling method based on parasitic inductive coupling theory for SiC wirebond multichip power module (SWMPM) with adjacent decoupling capacitor is proposed. Based on the proposed model, the strong and weak inductive coupling theory of DM interference equivalent circuit is proposed. And the influence of different position of decoupling capacitors on DM equivalent current is mathematically analyzed. A custom-made 1.2kV 160A power module based on DM interference optimized layout is built. It is compared with a commercial SiC power module, which can verify the feasibility and validity of the theoretical analysis.

Original languageEnglish
Article number9274371
Pages (from-to)2077-2081
Number of pages5
JournalIEEE Transactions on Circuits and Systems II: Express Briefs
Volume68
Issue number6
DOIs
StatePublished - Jun 2021

Keywords

  • EMI
  • SiC MOSFET
  • decoupling capacitors
  • differential-mode interference
  • inductive coupling
  • mathematical modeling
  • parallel-connected

Fingerprint

Dive into the research topics of 'DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module'. Together they form a unique fingerprint.

Cite this