TY - GEN
T1 - Development of 1D optical micro scanner driven by piezoelectric actuators
AU - Kobayashi, Takeshi
AU - Tsaur, Jiunnjye
AU - Maeda, Ryutaro
PY - 2005
Y1 - 2005
N2 - 1D optical micro scanners driven by piezoelectric actuators have designed, simulated, fabricated and tested. The newly designed micro scanners have a structure that rotation bars, hinges and PZT cantilevers support a square mirror (1mm × 1mm). Flat-structured micro scanners have been fabricated from Pt/PZT/Pt/Ti/SiO2/SOI(Si/SiO2/Si) multi-layered structure through conventional MEMS micro fabrication technologies. The micro scanner driven at 10 V showed an optical scan angle of 1.5 degree for the static actuation (60 Hz) and of 13 degree for the resonant actuation (4825 Hz), respectively.
AB - 1D optical micro scanners driven by piezoelectric actuators have designed, simulated, fabricated and tested. The newly designed micro scanners have a structure that rotation bars, hinges and PZT cantilevers support a square mirror (1mm × 1mm). Flat-structured micro scanners have been fabricated from Pt/PZT/Pt/Ti/SiO2/SOI(Si/SiO2/Si) multi-layered structure through conventional MEMS micro fabrication technologies. The micro scanner driven at 10 V showed an optical scan angle of 1.5 degree for the static actuation (60 Hz) and of 13 degree for the resonant actuation (4825 Hz), respectively.
UR - https://www.scopus.com/pages/publications/32844459696
U2 - 10.1115/ipack2005-73431
DO - 10.1115/ipack2005-73431
M3 - 会议稿件
AN - SCOPUS:32844459696
SN - 0791842002
SN - 9780791842003
T3 - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
SP - 789
EP - 792
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
PB - American Society of Mechanical Engineers
T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Y2 - 17 July 2005 through 22 July 2005
ER -