TY - GEN
T1 - Development and process optimization of C2W self-alignment & temporary bonding system
AU - Nakano, Yuta
AU - Lu, Jian
AU - Takagi, Hideki
AU - Hayase, Masanori
AU - Maeda, Ryutaro
PY - 2013
Y1 - 2013
N2 - Size-free MEMS-IC integration is important for MEMS ubiquitous applications as well as to reduce its production cost. In our previous work, we have proposed a 2-step approach for MEMS-IC integration by using chip to wafer (C2W) self-alignment and temporary bonding, and then wafer level permanent bonding. In this work, a prototype system for C2W self-alignment and temporary bonding was developed, and the process parameters, e.g. volume of H2O, wafer temperature, and annealing process, were studied and optimized for better success-ratio and system performance. The results presented in this paper revealed that the proposed system is practically applicable to size-free MEMS-IC integration with reasonably high efficiency.
AB - Size-free MEMS-IC integration is important for MEMS ubiquitous applications as well as to reduce its production cost. In our previous work, we have proposed a 2-step approach for MEMS-IC integration by using chip to wafer (C2W) self-alignment and temporary bonding, and then wafer level permanent bonding. In this work, a prototype system for C2W self-alignment and temporary bonding was developed, and the process parameters, e.g. volume of H2O, wafer temperature, and annealing process, were studied and optimized for better success-ratio and system performance. The results presented in this paper revealed that the proposed system is practically applicable to size-free MEMS-IC integration with reasonably high efficiency.
UR - https://www.scopus.com/pages/publications/84883076326
M3 - 会议稿件
AN - SCOPUS:84883076326
SN - 9781467344777
T3 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
BT - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
T2 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
Y2 - 16 April 2013 through 18 April 2013
ER -