Development and Manufacture for Free Form Mobile Phone Screen

  • Tan Li
  • , Li Xiaohu
  • , Li Ting
  • , Li Lingxia
  • , Cai Kaimin
  • , Li Wei
  • , Jiang Wei

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

When Apple Inc. pushed out their “ bang panel”(notch screen) in 2017 , many display manufacture companies set out to develop free form full screen of mobile phone. In order to seize the market quickly,Shanghai AVIC Photoelectron Co., Ltd (AVIC for short) developed and manufactured the panel only in three more months. This paper introduced how we realized rapid production of free form full screen and what problems we had solved. We discussed free form cutting not only by CNC (computer numerical control) grind but also by laser cutting. We also discussed free form sealant coating. Line open in Fanout Zone at CNC grind process was analyzed and solved. At last, a special “black blob” of free form screen from customer complaint was investigated and solved.

Original languageEnglish
Title of host publicationDigest of Technical Papers - SID International Symposium
EditorsBaoping Wang, Chi-Ming Che, Ching W. Tang, Han-Ping D. Shieh, Hoi S. Kwok, Hongxing Xu, Ming Liu, Qionghai Dai, Shou Peng, Vivian Wing-Wah Yam, Wei Huang, Xiaomo Wang, Yong Cao, Youliao Zheng, Yue Hao, Yunqi Liu, Zhongcan Ouyang, Zhonglin Wang, Zuyan Xu
PublisherJohn Wiley and Sons Inc
Pages599-602
Number of pages4
EditionS1
ISBN (Electronic)9781510896161, 9781510896161, 9781510896161
DOIs
StatePublished - 2019
Externally publishedYes
EventInternational Conference on Display Technology, ICDT 2019 - Suzhou, China
Duration: 26 Mar 201929 Mar 2019

Publication series

NameDigest of Technical Papers - SID International Symposium
NumberS1
Volume50
ISSN (Print)0097-966X
ISSN (Electronic)2168-0159

Conference

ConferenceInternational Conference on Display Technology, ICDT 2019
Country/TerritoryChina
CitySuzhou
Period26/03/1929/03/19

Keywords

  • Full screen;free form screen;CNC grind;laser cutting;HAZ;BM

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