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Developing MEMS electric current sensors for end-use monitoring of power supply: Part X - An IEEE802.11g protocol compliant integratable dual-frequency coaxial microstrip antenna

  • Liqiang Fan
  • , Dong F. Wang
  • , Toshihiro Itoh
  • , Zhongpeng Yu
  • , Ryutaro Maeda
  • Jilin University
  • National Institute of Advanced Industrial Science and Technology
  • The University of Tokyo
  • Engineering Maintenance Department

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In our initial work of DTIP, a passive DC MEMS current sensor was proposed for single-wire or dual-wire current detection (DTIP2011, DTIP2012). A new type of oscillating MEMS DC current sensor, composed of an excitation element and a sensing element, was further proposed in DTIP2013. Since then, a series of studies, such as cantilever-based magnetic field sensor device (DTIP2014), corresponding relation between polarization and output voltage (DTIP2015), corresponding relationship between sensitivity and magnetic inductance (DTIP2017), magnetic field distribution surrounding three-phase four-wire appliances (DTIP2018), segmentation design and empirical analysis of piezoeletric layers (DTIP2018), as well as threshold-triggered current sensing (DTIP2019), have been carried out from different aspects. This work however, is oriented to realize an IEEE802.11g protocol compliant integratable dual-frequency coaxial microstrip antenna for wireless sensor networks. The newly designed antenna can be operated under two frequency bands of 2.45GHz and 5.2GHz, meeting the new physical layer standard IEEE802.11g emerged in recent years. A wireless cantilever current sensor (WCCS) is conceptualized to be an integration of a magnetic cantilever for sensing currents and a dual-frequency coaxial microstrip antenna for transmitting signals.

Original languageEnglish
Title of host publication2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665402309
DOIs
StatePublished - 25 Aug 2021
Externally publishedYes
Event2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021 - Paris, France
Duration: 25 Aug 202127 Aug 2021

Publication series

Name2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021

Conference

Conference2021 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2021
Country/TerritoryFrance
CityParis
Period25/08/2127/08/21

Keywords

  • IEEE802.11g protocol
  • Integratable
  • dual-frequency coaxial microstrip antenna
  • magnetic cantilever
  • wireless cantilever current sensor (WCCS)

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