@inproceedings{f961ba0946cd4d09ae6867ad2119975f,
title = "Developing MEMS electric current sensors for end use monitoring of power supply: Part VIII - Segmentation design and empirical analysis of piezoelectric layers based on cantilever beam structure",
abstract = "In this paper, the piezoelectric layer segmentation design, which is based on the cantilever structure, has been proposed to increase the output voltage. The piezoelectric layer of the cantilever structure is firstly divided into equal parts with the same number. A mathematical model of the output voltage in the horizontal, vertical and oblique directions has been established. Subsequently, COMSOL Multi-physics software is used to verify the theoretical derivation. The simulation results show that regardless of the segmentation angle, the output voltage is proportional to the number of slices when the piezoelectric layer is equally divided into the same number of pieces. As for the equally wide-divided piezoelectric layer, the segmentation along the direction vertical to diagonal direction can obtain the greatest output voltage value.",
keywords = "Cantilever structure, Piezoelectric layer, Segmentation design, Sensitivity improvement, Theoretical",
author = "Yang Liu and Yang Chen and Wang, \{Dong F.\} and Yuan Lin and Xu Yang and Huan Liu and Yipeng Hou and Xuesong Shang and Ziqi Zhao and Toshihiro Itoh and Ryutaro Maeda",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 ; Conference date: 22-05-2018 Through 25-05-2018",
year = "2018",
month = jun,
day = "22",
doi = "10.1109/DTIP.2018.8394240",
language = "英语",
series = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--4",
editor = "Romolo Marcelli and Yoshio Mita and Stewart Smith and Francis Pressecq and Pascal Nouet and Frederick Mailly and Peter Schneider",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018",
}