Developing MEMS electric current sensors for end use monitoring of power supply: Part VIII - Segmentation design and empirical analysis of piezoelectric layers based on cantilever beam structure

  • Yang Liu
  • , Yang Chen
  • , Dong F. Wang
  • , Yuan Lin
  • , Xu Yang
  • , Huan Liu
  • , Yipeng Hou
  • , Xuesong Shang
  • , Ziqi Zhao
  • , Toshihiro Itoh
  • , Ryutaro Maeda

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the piezoelectric layer segmentation design, which is based on the cantilever structure, has been proposed to increase the output voltage. The piezoelectric layer of the cantilever structure is firstly divided into equal parts with the same number. A mathematical model of the output voltage in the horizontal, vertical and oblique directions has been established. Subsequently, COMSOL Multi-physics software is used to verify the theoretical derivation. The simulation results show that regardless of the segmentation angle, the output voltage is proportional to the number of slices when the piezoelectric layer is equally divided into the same number of pieces. As for the equally wide-divided piezoelectric layer, the segmentation along the direction vertical to diagonal direction can obtain the greatest output voltage value.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
EditorsRomolo Marcelli, Yoshio Mita, Stewart Smith, Francis Pressecq, Pascal Nouet, Frederick Mailly, Peter Schneider
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781538661994
DOIs
StatePublished - 22 Jun 2018
Externally publishedYes
Event20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 - Roma, Italy
Duration: 22 May 201825 May 2018

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018

Conference

Conference20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
Country/TerritoryItaly
CityRoma
Period22/05/1825/05/18

Keywords

  • Cantilever structure
  • Piezoelectric layer
  • Segmentation design
  • Sensitivity improvement
  • Theoretical

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