@inproceedings{d9cdf2d1581c405aa766fb295ca44a83,
title = "Design of Thermal Conductivity Gas Sensor with Silicon Cap",
abstract = "This paper presents the design of a suspended micro hotplate-based thermal conductivity gas sensor. A rectangular silicon cap is packaged above the micro hotplate, creating a 20μm air gap. This design increases the proportion of heat dissipation through gaseous thermal conduction in the total heat dissipation of the chip, significantly improving the sensitivity of gas detection. By comparing the differences in total thermal conductivity between the chip with the cap and without it, it can be observed that gas conduction, directly related to gas concentration, constitutes more than 91\% of the total thermal conductivity. Through evaluations conducted on a mixture of nitrogen gas with SF6 and H2, the chip with the silicon cap demonstrated effective detection of changes in SF6 at 200ppm and H2 at 50ppm.",
keywords = "Micro-Electro-Mechanical System (MEMS), micro hotplate, sensitivity, silicon cap, thermal conductivity",
author = "Changchun Wang and Binbin Jiao and Xin Liu and Chengyuan Zhao and Gangqiang Wu and Ruiwen Liu",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 16th IEEE International Conference on Electronic Measurement and Instruments, ICEMI 2023 ; Conference date: 09-08-2023 Through 11-08-2023",
year = "2023",
doi = "10.1109/ICEMI59194.2023.10270148",
language = "英语",
series = "Proceedings of 2023 IEEE 16th International Conference on Electronic Measurement and Instruments, ICEMI 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "204--208",
editor = "Juan Wu and Jiali Yin",
booktitle = "Proceedings of 2023 IEEE 16th International Conference on Electronic Measurement and Instruments, ICEMI 2023",
}