@inproceedings{d68a8eb3053a453c8a462ae1c85ce954,
title = "Design of high power density DC-DC converter based on embedded passive substrate",
abstract = "For higher power density of power electronics converters, the integration of passive into the printed circuit board (PCB) is a low cost and integral manufacturing approach. The passive substrate concept for power electronics is proposed in this paper. Based on it, the converter level packaging can be implemented. The commercially available Ferrite materials with low high frequency loss can be embedded in the PCB. Thus, transformers and inductors can be entirely integrated in the PCB. The configuration and manufacturing processes of the embedded passive substrate are described. Accordingly, the synchronous full-bridge bus converter with 12V/26A output is designed and manufactured using the passive substrate. The electrical and thermal characteristics of the passive substrate are illustrated. The thin converter, better thermal performance and high power density can be achieved.",
keywords = "Ferrite, Passive substrate, Printed circuit board",
author = "Zhankun Gong and Qiaoliang Chen and Xu Yang and Bo Yuan and Weiyi Feng and Zhaoan Wang",
year = "2008",
doi = "10.1109/PESC.2008.4591939",
language = "英语",
isbn = "9781424416684",
series = "PESC Record - IEEE Annual Power Electronics Specialists Conference",
pages = "273--277",
booktitle = "Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007",
note = "PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference ; Conference date: 15-06-2008 Through 19-06-2008",
}