@inproceedings{dde6224df7b44fe19c2779924977cd0b,
title = "Design and research of ultra-miniature pressure sensors",
abstract = "This paper reports the design and fabrication of dynamic ultra-miniature pressure sensor. Based on bulk silicon MEMS micromachining technology, the Si-Si direct vacuum bonding and thinning technology with precision control were used to fabricate the subminiature silicon piezoresistive chip for absolute pressure measurement. The sensors with outer diameter Φ2.0mm were packaged with miniature probe mode, which have the natural frequency of 300∼1000 kHz. The ultra-small dynamic pressure sensors may be used to aerodynamics research successfully.",
keywords = "MEMS, Quasi-flat package, Si/Si direct bonding, Ultra-miniature",
author = "Bing Wang and Yulong Zhao and Xinli Cheng and Wenxiang Wang",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 10th International Conference on Sensing Technology, ICST 2016 ; Conference date: 11-11-2016 Through 13-11-2016",
year = "2016",
month = dec,
day = "22",
doi = "10.1109/ICSensT.2016.7796246",
language = "英语",
series = "Proceedings of the International Conference on Sensing Technology, ICST",
publisher = "IEEE Computer Society",
booktitle = "2016 10th International Conference on Sensing Technology, ICST 2016",
}