Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks

Yanmei Kong; Binbin Jiao; Lemin Zhang; Shichang Yun; Dapeng Chen

doi:10.1109/TRANSDUCERS.2017.7994207

Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks

Yanmei Kong
, Binbin Jiao
, Lemin Zhang
, Shichang Yun
, Dapeng Chen

CAS - Institute of Microelectronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

14 Scopus citations

Abstract

This paper presents a wafer-level packaged MEMS (Micro-electromechanical Systems) Pirani gauge with surrounded heat sinks with improved characteristics during the low limit of the cavity vacuum. Different to the reported gauges in other papers, it has four heat sinks, and one of these is the cap of the wafer-level package. And it utilizes two heaters and two constant resistors to construct an Whetstone Bridge, two meander-shaped suspended silicon coils is set as the heaters and two isolated comb-shaped silicon structures as the dual-lateral heat sinks. In addition, the substrate and capped wafers are used as dual-vertical heat sinks. The gauge is finally realized with the volume 1.4mm×1.2mm×0.5mm using the CMOS (Complementary Metal Oxide Semiconductor)-MEMS compatible process. The gauge was measured twice before and after wafer-level packaging. It denotes that with the introduction of the capped heat sink, the device bears a better sensitivity compared to the intermediate device before packaging. With a hole on the edge of the device, the gauge could be widely and flexibly used for the characterization of vacuum packaged MEMS devices.

Original language	English
Title of host publication	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	950-953
Number of pages	4
ISBN (Electronic)	9781538627310
DOIs	https://doi.org/10.1109/TRANSDUCERS.2017.7994207
State	Published - 26 Jul 2017
Externally published	Yes
Event	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China Duration: 18 Jun 2017 → 22 Jun 2017

Publication series

Name	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Country/Territory	Taiwan, Province of China
City	Kaohsiung
Period	18/06/17 → 22/06/17

Keywords

Heat Sink
Pirani Gauge
Wafer Level Package

Access to Document

10.1109/TRANSDUCERS.2017.7994207

Cite this

Kong, Y., Jiao, B., Zhang, L., Yun, S., & Chen, D. (2017). Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 950-953). Article 7994207 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7994207

Kong, Yanmei ; Jiao, Binbin ; Zhang, Lemin et al. / Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks. TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 950-953 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

@inproceedings{7562952caf9d4837b91a8e2eb79ec8cd,

title = "Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks",

abstract = "This paper presents a wafer-level packaged MEMS (Micro-electromechanical Systems) Pirani gauge with surrounded heat sinks with improved characteristics during the low limit of the cavity vacuum. Different to the reported gauges in other papers, it has four heat sinks, and one of these is the cap of the wafer-level package. And it utilizes two heaters and two constant resistors to construct an Whetstone Bridge, two meander-shaped suspended silicon coils is set as the heaters and two isolated comb-shaped silicon structures as the dual-lateral heat sinks. In addition, the substrate and capped wafers are used as dual-vertical heat sinks. The gauge is finally realized with the volume 1.4mm×1.2mm×0.5mm using the CMOS (Complementary Metal Oxide Semiconductor)-MEMS compatible process. The gauge was measured twice before and after wafer-level packaging. It denotes that with the introduction of the capped heat sink, the device bears a better sensitivity compared to the intermediate device before packaging. With a hole on the edge of the device, the gauge could be widely and flexibly used for the characterization of vacuum packaged MEMS devices.",

keywords = "Heat Sink, Pirani Gauge, Wafer Level Package",

author = "Yanmei Kong and Binbin Jiao and Lemin Zhang and Shichang Yun and Dapeng Chen",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 ; Conference date: 18-06-2017 Through 22-06-2017",

year = "2017",

month = jul,

day = "26",

doi = "10.1109/TRANSDUCERS.2017.7994207",

language = "英语",

series = "TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems",

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Kong, Y, Jiao, B, Zhang, L, Yun, S & Chen, D 2017, Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks. in TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems., 7994207, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, Institute of Electrical and Electronics Engineers Inc., pp. 950-953, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan, Province of China, 18/06/17. https://doi.org/10.1109/TRANSDUCERS.2017.7994207

Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks. / Kong, Yanmei; Jiao, Binbin; Zhang, Lemin et al.
TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. p. 950-953 7994207 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks

AU - Kong, Yanmei

AU - Jiao, Binbin

AU - Zhang, Lemin

AU - Yun, Shichang

AU - Chen, Dapeng

PY - 2017/7/26

Y1 - 2017/7/26

N2 - This paper presents a wafer-level packaged MEMS (Micro-electromechanical Systems) Pirani gauge with surrounded heat sinks with improved characteristics during the low limit of the cavity vacuum. Different to the reported gauges in other papers, it has four heat sinks, and one of these is the cap of the wafer-level package. And it utilizes two heaters and two constant resistors to construct an Whetstone Bridge, two meander-shaped suspended silicon coils is set as the heaters and two isolated comb-shaped silicon structures as the dual-lateral heat sinks. In addition, the substrate and capped wafers are used as dual-vertical heat sinks. The gauge is finally realized with the volume 1.4mm×1.2mm×0.5mm using the CMOS (Complementary Metal Oxide Semiconductor)-MEMS compatible process. The gauge was measured twice before and after wafer-level packaging. It denotes that with the introduction of the capped heat sink, the device bears a better sensitivity compared to the intermediate device before packaging. With a hole on the edge of the device, the gauge could be widely and flexibly used for the characterization of vacuum packaged MEMS devices.

AB - This paper presents a wafer-level packaged MEMS (Micro-electromechanical Systems) Pirani gauge with surrounded heat sinks with improved characteristics during the low limit of the cavity vacuum. Different to the reported gauges in other papers, it has four heat sinks, and one of these is the cap of the wafer-level package. And it utilizes two heaters and two constant resistors to construct an Whetstone Bridge, two meander-shaped suspended silicon coils is set as the heaters and two isolated comb-shaped silicon structures as the dual-lateral heat sinks. In addition, the substrate and capped wafers are used as dual-vertical heat sinks. The gauge is finally realized with the volume 1.4mm×1.2mm×0.5mm using the CMOS (Complementary Metal Oxide Semiconductor)-MEMS compatible process. The gauge was measured twice before and after wafer-level packaging. It denotes that with the introduction of the capped heat sink, the device bears a better sensitivity compared to the intermediate device before packaging. With a hole on the edge of the device, the gauge could be widely and flexibly used for the characterization of vacuum packaged MEMS devices.

KW - Heat Sink

KW - Pirani Gauge

KW - Wafer Level Package

UR - https://www.scopus.com/pages/publications/85029363534

U2 - 10.1109/TRANSDUCERS.2017.7994207

DO - 10.1109/TRANSDUCERS.2017.7994207

M3 - 会议稿件

AN - SCOPUS:85029363534

T3 - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

SP - 950

EP - 953

BT - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017

Y2 - 18 June 2017 through 22 June 2017

ER -

Kong Y, Jiao B, Zhang L, Yun S, Chen D. Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc. 2017. p. 950-953. 7994207. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). doi: 10.1109/TRANSDUCERS.2017.7994207

Design and fabrication of wafer-level packaged MEMS Pirani gauge with sorrounded heat sinks

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Keywords

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