TY - JOUR
T1 - Densification and grain growth in ceramics fabricated by cold sintering
T2 - A review on the effect of process parameters
AU - Palneedi, Haribabu
AU - Sharief, Pathan
AU - Hong, Sang Min
AU - Kim, Jong Won
AU - Uzair, Muhammad
AU - Jeon, Sang Chae
AU - Guo, Jing
N1 - Publisher Copyright:
© 2025 The American Ceramic Society.
PY - 2026/1
Y1 - 2026/1
N2 - The cold-sintering process (CSP) has been developed as an alternative method for the densification of ceramics at significantly low temperatures (<300°C) and in a short time (<2 h), with potential applications in the fabrication of high-performance ceramics and for the reliable integration of dissimilar materials such as metals, polymers, and ceramics into multifunctional devices. Relying upon the combined use of transient liquid media, mechanical pressure, and heat, CSP offers both fundamental and technological advantages compared with conventional sintering, minimizing energy consumption and enhancing the efficiency of the sintering process. Besides a brief overview of the densification mechanisms of CSP, knowledge obtained from earlier studies thus far regarding the effects on densification and grain growth behavior of various materials and processing parameters, such as the powder characteristics, solvent chemistry, temperature, heating rate, pressure, and dwell time, is discussed in detail in this review. Efforts that have been made to bring CSP technology into mainstream manufacturing are also described. Challenges and opportunities related to the preparation of the starting materials, the tooling quality, optimization of the process parameters, and in situ and ex situ characterization of sintered materials for the development of high-performance ceramics by the CSP method are also explored.
AB - The cold-sintering process (CSP) has been developed as an alternative method for the densification of ceramics at significantly low temperatures (<300°C) and in a short time (<2 h), with potential applications in the fabrication of high-performance ceramics and for the reliable integration of dissimilar materials such as metals, polymers, and ceramics into multifunctional devices. Relying upon the combined use of transient liquid media, mechanical pressure, and heat, CSP offers both fundamental and technological advantages compared with conventional sintering, minimizing energy consumption and enhancing the efficiency of the sintering process. Besides a brief overview of the densification mechanisms of CSP, knowledge obtained from earlier studies thus far regarding the effects on densification and grain growth behavior of various materials and processing parameters, such as the powder characteristics, solvent chemistry, temperature, heating rate, pressure, and dwell time, is discussed in detail in this review. Efforts that have been made to bring CSP technology into mainstream manufacturing are also described. Challenges and opportunities related to the preparation of the starting materials, the tooling quality, optimization of the process parameters, and in situ and ex situ characterization of sintered materials for the development of high-performance ceramics by the CSP method are also explored.
KW - ceramics
KW - cold sintering
KW - densification
KW - grain growth
KW - process parameters
UR - https://www.scopus.com/pages/publications/105017708253
U2 - 10.1111/jace.70268
DO - 10.1111/jace.70268
M3 - 文献综述
AN - SCOPUS:105017708253
SN - 0002-7820
VL - 109
JO - Journal of the American Ceramic Society
JF - Journal of the American Ceramic Society
IS - 1
M1 - e70268
ER -