@inproceedings{da28a2783b75493bb05201eabc50b7a5,
title = "Deformation and removal characteristics of multilayered thin film structures in nanoscratching and diamond lapping",
abstract = "The deformation and removal mechanism of a multilayered thin film structure involved in nanoscratching and diamond lapping processes were investigated. The results obtained from the two processes were compared, in terms of deformation characteristics and surface finish. It was found that both nanoscratching and lapping demonstrated similar characteristics. This work provides insight into the deformation and removal of a thin film multilayered structure undermechanical loading, and thus the outcome is of value for developing the efficient machining process for such structures.",
keywords = "Deformation, Lapping, Multilayer, Nanoscratch, Removal, Thin film",
author = "Kang, \{Cheng Wei\} and Han Huang",
note = "Publisher Copyright: {\textcopyright} (2014) Trans Tech Publications, Switzerland.; 17th International Symposium on Advances in Abrasive Technology, ISAAT 2014 ; Conference date: 22-09-2014 Through 25-09-2014",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.1017.61",
language = "英语",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications Ltd",
pages = "61--65",
editor = "Jiwang Yan and Hideki Aoyama and Akinori Yui",
booktitle = "Advances in Abrasive Technology XVII",
}