Deformable interconnects for conformal integrated circuits

  • Stéphanie Périchon Lacour
  • , Zhenyu Huang
  • , Zhigang Suo
  • , Sigurd Wagner

Research output: Contribution to journalConference articlepeer-review

12 Scopus citations

Abstract

The electro-mechanical response of thin gold layers evaporated onto silicone substrates is reported. Gold layers are prepared either thin and flat or thin and wavy on the compliant substrate. The electrical resistance of gold/silicone stripes is measured and analyzed during tensile deformation. For a 100-nm thick gold layer evaporated on a 1-mm thick silicone membrane, we have observed electrical continuity up to ∼ 22 % strain. This maximum strain decreases when the gold layer thickness is raised.

Original languageEnglish
Pages (from-to)183-188
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume736
StatePublished - 2002
EventElectronics on Unconventional Substrates-Electrotextiles and Giant-Area Flexible Circuits - Boston, MA, United States
Duration: 2 Dec 20023 Dec 2002

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