Cryogenic Overcurrent Characteristic of GaN HEMT and Converter Evaluation

Cryogenic power electronics is regarded as the next step to improve the converter efficiency and power density. It is advantageous in many different applications, including aerospace, renewable energy, transportation and so on. Among all different semiconductors, gallium nitride (GaN) was found more advantageous with significant loss reduction at cryogenic temperature. In this paper, overcurrent test is performed and analyzed for a high-efficient commercial GaN high electron mobility transistor (HEMT). The experimental results demonstrate a significant improvement of the device overcurrent capability at cryogenic temperature (from 160 A at room temperature to 250 A at cryogenic temperature). The operating mechanisms behind the overcurrent test are investigated and discussed. Finally, a 5 kW GaN HEMT based cryogenic Buck converter is built and tested. Maximum efficiency of 98.5% is achieved at 1.5 kW output power and around 1% efficiency improvement can be achieved when compared to room temperature operation. Another GaN HEMT based four-switch Buck-boost converter is evaluated at cryogenic temperature, maximum efficiency improvement of 1.5% is observed when compared to room temperature.