TY - GEN
T1 - Crescent shaped patterns for self-alignment of micro-parts
T2 - 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
AU - Liu, Mengqing
AU - Wang, Dong F.
AU - Shiga, Shouhei
AU - Ishida, Takao
AU - Maeda, Ryutaro
N1 - Publisher Copyright:
© 2014 Circuits Multi Projets - CMP.
PY - 2014/3/9
Y1 - 2014/3/9
N2 - A 'crescent-shaped' binding alignment mark, more applicable to the self-alignment than reported 'tear-drop/elliptical hole' pattern, was designed and comparatively studied with other possible alignment marks by introducing the overlap ratio analysis (DTIP 2011). Recently, in order to apply this novel design to micro-parts with positive and negative poles on the binding sites, a modified 'crescent-shaped' pattern with an insulated space area, defined as 'crescent-shaped/interval' for self-alignment of micro-parts with two poles was further proposed and discussed. In this report however, the self-alignment process has been in-situ observed and studied using a 'square' binding alignment pattern with relatively higher energy barrier but four fully aligned orientations at four off-set angles. Sequential images reveal a slow translational motion in the early stage followed by a faster rotational alignment. The conductivity evaluation before and after the self-alignment of micro-parts has been also preliminarily considered.
AB - A 'crescent-shaped' binding alignment mark, more applicable to the self-alignment than reported 'tear-drop/elliptical hole' pattern, was designed and comparatively studied with other possible alignment marks by introducing the overlap ratio analysis (DTIP 2011). Recently, in order to apply this novel design to micro-parts with positive and negative poles on the binding sites, a modified 'crescent-shaped' pattern with an insulated space area, defined as 'crescent-shaped/interval' for self-alignment of micro-parts with two poles was further proposed and discussed. In this report however, the self-alignment process has been in-situ observed and studied using a 'square' binding alignment pattern with relatively higher energy barrier but four fully aligned orientations at four off-set angles. Sequential images reveal a slow translational motion in the early stage followed by a faster rotational alignment. The conductivity evaluation before and after the self-alignment of micro-parts has been also preliminarily considered.
KW - Conductivity evaluation
KW - In-situ observation
KW - Maximum overlap ratio
KW - One-mask micromachining
KW - Self-alignment demonstration
KW - Square binding pattern
UR - https://www.scopus.com/pages/publications/84946685449
U2 - 10.1109/DTIP.2014.7056687
DO - 10.1109/DTIP.2014.7056687
M3 - 会议稿件
AN - SCOPUS:84946685449
T3 - DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
BT - DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 2 April 2014 through 4 April 2014
ER -