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Cooperative buckling of parallel nanowires on elastomeric substrates

  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The cooperative buckling behaviors of parallel nanowires on an elastomeric substrate are investigated based on a finite element framework. Under compression of the elastomeric substrate, an especial helical buckling mode of nanowires and buckling evolution with effective compressive strain are observed. It is revealed that typical buckling characteristics of two parallel nanowires strongly depend on the distance between them. When the distance is smaller than a critical value hS/2 (half of a representative buckling spacing of a single nanowire on an elastomeric substrate), with decreasing of the separation distance, the buckling spacing, displacement amplitudes and the ratio between the in-/out-of-plane amplitudes all increase significantly. For parallel nanowire assembles, when the nanowires are closely arrayed, the buckling spacing notably increases with the number of nanowires. This study contributes to controllable buckling of stiff elements on a soft substrate and may shed some light on the design and optimization of flexible electronics.

Original languageEnglish
Title of host publicationMaterial Science and Engineering - Proceedings of the 3rd Annual International Conference on Material Science and Engineering, ICMSE 2015
EditorsPing Chen
PublisherCRC Press/Balkema
Pages271-275
Number of pages5
ISBN (Print)9781138029361
DOIs
StatePublished - 2016
Event3rd Annual International Conference on Material Science and Engineering, ICMSE 2015 - Guangzhou, China
Duration: 15 May 201517 May 2015

Publication series

NameMaterial Science and Engineering - Proceedings of the 3rd Annual International Conference on Material Science and Engineering, ICMSE 2015

Conference

Conference3rd Annual International Conference on Material Science and Engineering, ICMSE 2015
Country/TerritoryChina
CityGuangzhou
Period15/05/1517/05/15

Keywords

  • Finite element simulation
  • Flexible electronics
  • Helical buckling
  • Nanowire assemblies

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