Construction and Properties of Cu-/Zr-Based Thin Films on Glass Substrate

A novel method for metallization of a glass substrate is proposed to improve adhesion strength between the glass and the metal layer. The Cu/glass substrate was fabricated using magnetron sputtering with the addition of nanoscale multilayer films (Zr/ZrN/Zr/ZrN/Zr/ZrN) as transition layers. The microstructure of the Cu capping layer and the interface between Cu and glass were investigated. The results indicate that the (ZrN/Zr)_x gradient layer is uniform and dense, exhibiting crystalline characteristics that help optimize the interface structure. As the ZrN/Zr gradient layer thickens, the interfacial bonding strength between the metal layer and the glass substrate gradually increases. Among different periods, when the period is 3, the critical load of the Cu/(ZrN/Zr)₃ stack structure is 80 N. This study provides an important strategy for designing and constructing a new type of glass substrate.