Comparison of femtosecond laser-induced front- and rear-side ablation of films

Femtosecond laser rear-side ablation, in which the laser beam first passes through the substrate, then irradiates on the film at the substrate-film interface, can be used to fabricate films on a transparent substrate. In this method, the material removal mechanism is different from that in front-side ablation, and the ablation occurs in an enclosed space. The different material removal process in rear-side laser ablation will bring about some unique ablation results. In this paper, the material removal mechanisms and ablation results of Cr film in rearside ablation are investigated by comparing with those in front-side ablation. It is found that rear-side ablation can achieve smaller feature size than front-side ablation, especially when the laser fluence is small. However, owing to its different material breaking and ejecting process, the rear-side ablation tends to have worse bottom morphology and irregular edge morphology. In addition, the microstructures in the two ablations have opposite cross-sectional shapes and the ripple period in rear-side ablation is larger than that in front-side ablation.