Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration

Jian Lu; Hideki Takagi; Ryutaro Maeda

doi:10.1109/ICSENS.2011.6126924

Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration

Jian Lu
, Hideki Takagi
, Ryutaro Maeda

National Institute of Advanced Industrial Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

In this paper, we present a low-cost and rapid self-alignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF ₃(CF ₂) ₇(CH ₂) ₂SiCl ₃), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H ₂O (∼μl/cm ²) was then dropped and spread on the non-coated hydrophilic SiO ₂ surface for temporary bonding of MEMS chip. Our results demonstrated that the hydrophobic FDTS pattern on carrier wafer enables rapid and precise self-alignment of MEMS chip onto SiO ₂ binding-site by capillary force. After transfer the MEMS chips to target wafer, FDTS can be removed by O ₂ plasma treatment or UV irradiation.

Original language	English
Title of host publication	IEEE Sensors 2011 Conference, SENSORS 2011
Pages	1121-1124
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2011.6126924
State	Published - 2011
Externally published	Yes
Event	10th IEEE SENSORS Conference 2011, SENSORS 2011 - Limerick, Ireland Duration: 28 Oct 2011 → 31 Oct 2011

Publication series

Name	Proceedings of IEEE Sensors

Conference

Conference	10th IEEE SENSORS Conference 2011, SENSORS 2011
Country/Territory	Ireland
City	Limerick
Period	28/10/11 → 31/10/11

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10.1109/ICSENS.2011.6126924

Cite this

@inproceedings{4f3d91f7e4114d28b8b0b7a4efb2b254,

title = "Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration",

abstract = "In this paper, we present a low-cost and rapid self-alignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF 3(CF 2) 7(CH 2) 2SiCl 3), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H 2O (∼μl/cm 2) was then dropped and spread on the non-coated hydrophilic SiO 2 surface for temporary bonding of MEMS chip. Our results demonstrated that the hydrophobic FDTS pattern on carrier wafer enables rapid and precise self-alignment of MEMS chip onto SiO 2 binding-site by capillary force. After transfer the MEMS chips to target wafer, FDTS can be removed by O 2 plasma treatment or UV irradiation.",

author = "Jian Lu and Hideki Takagi and Ryutaro Maeda",

year = "2011",

doi = "10.1109/ICSENS.2011.6126924",

language = "英语",

isbn = "9781424492886",

series = "Proceedings of IEEE Sensors",

pages = "1121--1124",

booktitle = "IEEE Sensors 2011 Conference, SENSORS 2011",

note = "10th IEEE SENSORS Conference 2011, SENSORS 2011 ; Conference date: 28-10-2011 Through 31-10-2011",

}

TY - GEN

T1 - Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration

AU - Lu, Jian

AU - Takagi, Hideki

AU - Maeda, Ryutaro

PY - 2011

Y1 - 2011

N2 - In this paper, we present a low-cost and rapid self-alignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF 3(CF 2) 7(CH 2) 2SiCl 3), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H 2O (∼μl/cm 2) was then dropped and spread on the non-coated hydrophilic SiO 2 surface for temporary bonding of MEMS chip. Our results demonstrated that the hydrophobic FDTS pattern on carrier wafer enables rapid and precise self-alignment of MEMS chip onto SiO 2 binding-site by capillary force. After transfer the MEMS chips to target wafer, FDTS can be removed by O 2 plasma treatment or UV irradiation.

AB - In this paper, we present a low-cost and rapid self-alignment process for temporary bonding of MEMS chip onto carrier wafer for size-free MEMS-IC integration. For the first time, a hydrophobic self-assembled monolayer (SAM), FDTS (CF 3(CF 2) 7(CH 2) 2SiCl 3), was successfully patterned by lift-off process on an oxidized silicon carrier wafer. Small volume of H 2O (∼μl/cm 2) was then dropped and spread on the non-coated hydrophilic SiO 2 surface for temporary bonding of MEMS chip. Our results demonstrated that the hydrophobic FDTS pattern on carrier wafer enables rapid and precise self-alignment of MEMS chip onto SiO 2 binding-site by capillary force. After transfer the MEMS chips to target wafer, FDTS can be removed by O 2 plasma treatment or UV irradiation.

UR - https://www.scopus.com/pages/publications/84863038474

U2 - 10.1109/ICSENS.2011.6126924

DO - 10.1109/ICSENS.2011.6126924

M3 - 会议稿件

AN - SCOPUS:84863038474

SN - 9781424492886

T3 - Proceedings of IEEE Sensors

SP - 1121

EP - 1124

BT - IEEE Sensors 2011 Conference, SENSORS 2011

T2 - 10th IEEE SENSORS Conference 2011, SENSORS 2011

Y2 - 28 October 2011 through 31 October 2011

ER -

Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration

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