TY - GEN
T1 - Characteristics of dielectric relaxation and low-frequency conduction in silicone rubber composite
AU - Wang, Weiwang
AU - Li, Zhen
AU - Frechette, Michel
AU - Li, Shengtao
AU - Chen, Linshan
AU - Li, Xiyu
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/29
Y1 - 2018/6/29
N2 - The microstructure and charge transport mechanisms of silicon rubber (SR) composite are the key influential factors for its dielectric performance. This study reports on the dielectric response of the silicon rubber composite by dielectric spectroscopy and discusses the molecular chain relaxation and electric conduction characteristics of the composite. The experimental results show that an obvious chain relaxation response exists under low temperature (< 0 oC). The composite permittivity behavior as a function of frequency was found to follow the Debye relaxation theory. Over the temperature range from 0 to 100 oC, a significant increase of permittivity under low frequency was observed, indicating a kind of interfacial polarization and a distinct electric conduction at low frequency. The dielectric relaxation at high temperature and middle frequency becomes wider and is hidden by the conduction. The conduction process under low frequency and the parameters of the dielectric responses were obtained using the Cole-Cole polarization model. After analysis, a longer relaxation time and a lower activation energy than usual were calculated, possibly due to the restricted molecular chain movements under the low-temperature condition and middle-frequency range. Additionally, a strong thermally assisted conduction process seemingly occurs inside the sample. This would possibly stem from the ionic conduction associated with impurities and charge carrier transport at the interfaces (hopping conduction). The estimated activation energy of the conduction was found to be 0.23 eV according to the Arrhenius equation.
AB - The microstructure and charge transport mechanisms of silicon rubber (SR) composite are the key influential factors for its dielectric performance. This study reports on the dielectric response of the silicon rubber composite by dielectric spectroscopy and discusses the molecular chain relaxation and electric conduction characteristics of the composite. The experimental results show that an obvious chain relaxation response exists under low temperature (< 0 oC). The composite permittivity behavior as a function of frequency was found to follow the Debye relaxation theory. Over the temperature range from 0 to 100 oC, a significant increase of permittivity under low frequency was observed, indicating a kind of interfacial polarization and a distinct electric conduction at low frequency. The dielectric relaxation at high temperature and middle frequency becomes wider and is hidden by the conduction. The conduction process under low frequency and the parameters of the dielectric responses were obtained using the Cole-Cole polarization model. After analysis, a longer relaxation time and a lower activation energy than usual were calculated, possibly due to the restricted molecular chain movements under the low-temperature condition and middle-frequency range. Additionally, a strong thermally assisted conduction process seemingly occurs inside the sample. This would possibly stem from the ionic conduction associated with impurities and charge carrier transport at the interfaces (hopping conduction). The estimated activation energy of the conduction was found to be 0.23 eV according to the Arrhenius equation.
KW - dielectric relaxation
KW - electric conduction
KW - molecular movement
KW - relaxation time
KW - silicon rubber composite
UR - https://www.scopus.com/pages/publications/85049843302
U2 - 10.1109/ICPADM.2018.8401170
DO - 10.1109/ICPADM.2018.8401170
M3 - 会议稿件
AN - SCOPUS:85049843302
T3 - Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials
SP - 884
EP - 887
BT - ICPADM 2018 - 12th International Conference on the Properties and Applications of Dielectric Materials
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th International Conference on the Properties and Applications of Dielectric Materials, ICPADM 2018
Y2 - 20 May 2018 through 24 May 2018
ER -